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Manufacturing/Packaging??

Centrifugal cleaning for advanced circuit assemblies

Posted: 01 Apr 2000 ?? ?Print Version ?Bookmark and Share

Keywords:speedline? flipchip? bga? package assembly? centrifugal cleaning?

As a manufacturer, you face the simultaneous challenges of qualifying new cleaning compounds and equipment designs for improved cleaning results. Centrifugal cleaning may be the solution to overcome shortcomings of present cleaning processes.

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