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Manufacturing/Packaging??

A high density Ball Grid Array connector system

Posted: 01 Apr 2000 ?? ?Print Version ?Bookmark and Share

Keywords:fci? smt? lcp? surface mount technology? ball grid array?

This paper describes the BGA product, process, and reliability testing. It primarily focuses on the development of the BGA board application process and the capabilities this technology brings about.

View the PDF document for more information.



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