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CPU thermal management

Posted: 08 Mar 2000 ?? ?Print Version ?Bookmark and Share

Keywords:amd? advanced micro devices? cpu thermal management? heat sink? fan combination?

This application note describes the CPU thermal management practices using a heat sink/fan combination for microprocessor functions. The heat sink/fan assembly helps to guard against processor overheating in systems where the airflow may be restricted by the addition of add-in cards or modules that can block airflow necessary for proper CPU cooling.

View the PDF document for more information.

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