EDA/IP??
CPU thermal management
Keywords:amd? advanced micro devices? cpu thermal management? heat sink? fan combination?
This application note describes the CPU thermal management practices using a heat sink/fan combination for microprocessor functions. The heat sink/fan assembly helps to guard against processor overheating in systems where the airflow may be restricted by the addition of add-in cards or modules that can block airflow necessary for proper CPU cooling.
View the PDF document for more information.
View the PDF document for more information.
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