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CSP die shrink solution for memory devices

Posted: 10 Mar 2000 ?? ?Print Version ?Bookmark and Share

Keywords:rambus? csp? sdram? direct rambus dram? rdram?

This application note shows the effectiveness of die shrink as a package solution for memory devices. In the case of the 8-by-10mm Direct Rambus DRAM device, about 350 dies can be obtained from a single 203.2mm wafer. The 85 percent linear shrink allows an addition of 150 dice from the same size wafer.

View the PDF document for more information.

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