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RF modules for cellular/PCS handsets

Posted: 09 Sep 1999 ?? ?Print Version ?Bookmark and Share

Keywords:cdma? anadigics? silicon transistor? handset trend? radio architecture?

/ARTICLES/1999SEP/1999SEP09_ICD_BD_TAC.PDF

Wireless Technologies China `99 ? Conference Proceedings 169 Introduction Similar to the explosive in the Internet services, demand for Cellilat and PCS services has been growing by leaps and bumps. As a result, from 1997 to 1998 worldwide handset production increased from 110 millions to 160 millions and the forecast for 1999 is close to 200 millionds.At that rate, handset produc- tion will out-run PC production by a factor of almost 2 to 1 this year. There are serveral driving forces: ? Cost of service is getting cheaper every year ? Quality of service is better with new digital GSM, CDMA and TDMA air interface standards than the older analog standards ? Handsets are getting smaller, lighter and more feature rich every six months A state-of-art handset measures less than 3-4 inch long and weights less than 4-5 ounces and provides the following features: ? Dual or triple frequency bands ? 4.5 hours talk time ? 200 hours standby time ? Phone book with more than 250 names ? Conference calls ? Call hold/Call wait ? Alternative line service ? Automatic world clock ? Two games, Tetris and Solitaire ? Easy access to the 20 latest numbers dialed, calls received or missed ? Advice of charging ? Fixed dialing numbers ? Call baring ? Calling line identification ? SIM application tool kit The competetive bat is raised every time a major handset supplier introduces a new model. To meet the challenges, handset manufacturers demand more and more from their component supplier. For ra- dios, the Holy Grail si "Radio on a Single Silicon Chip". As much as it's desired, "Radio on a Single Silicon Chip"is not technically feasible because ? 110 DB selectivity requires passive filters such as SAW or dieletctric filters ? Long talk time requires GaAs power amplifiers and switches As a result, multi-chip modules (MCMs) which integrate differebt type of chips inside a single mechnaical housing become an attractive alternative. RF modules for handsets In figure 1, a CDMA PA module is presented. The module in- corporates GaAs IC, silicon transistor, chip resistors and ca- pacitors. It delivers 29 dBm output power at PCS frequencies. In figure 2, a SAW receiver module is presented. The module incorporates GaAs ICs and surface acoustic wave (SAW) fil- ters and deliver superior performance for handset receivers. Figure 1: A CDMA PA Module RF Modules for Cellular/PCS Handsets Dr. Charles Huang ANADIGICS, Inc. Wireless Technologies China `99 ? Conference Proceedings170 Figure2: A SAW Receiver Module Summary RF module deliver optimal solutions for state of the art hand- sets. Presentation Materials Wireless Technologies China `99 ? Conference Proceedings 171 Wireless Technologies China `99 ? Conference Proceedings172 Wireless Technologies China `99 ? Conference Proceedings 173 Wireless Technologies China `99 ? Conference Proceedings174 Wireless Technologies China `99 ? Conference Proceedings 175 Wireless Technologies China `99 ? Conference Proceedings176 Wireless Technologies China `99 ? Conference Proceedings 177




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