Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Novel ACF for flip-chip attach

Posted: 01 Jun 2000 ?? ?Print Version ?Bookmark and Share

Keywords:loctite? flip chip assembly material? anisotropically conductive film? acf? image analysis?

This paper focuses on determining the advantages achieved with the new 'ordered' ACF on actual flip-chip assemblies. In particular, the distribution of conductive particles are determined on the flip-chip bumps and results are compared to theoretical predictions.

View the PDF document for more information.

Article Comments - Novel ACF for flip-chip attach
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top