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Effects of NEMI reflow on PTHs

Posted: 01 Oct 2000 ?? ?Print Version ?Bookmark and Share

Keywords:reflow? plated through hole? solder finish? thermal requirement? fr4?

This paper evaluates the changes in plated through-hole (PTH) performance and laminate material properties for several epoxy-based laminate systems caused by the thermal reflow requirements of the NEMI higher temperature alloy.

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