Manufacturing/Packaging??
Via-fill materials for next-generation interconnect
Keywords:jm3200 series? jm3201? via fill? fr4? adhesive bonding?
Via-fill polymers for next-gen interconnects are designed to improve on the performance capabilities of traditional epoxy-based via-plug materials.
View the PDF document for more information.
View the PDF document for more information.
Article Comments - Via-fill materials for next-generati...
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