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Innovative mounting techniques enhance thermal performance of the surface-mount D3Pak Package

Posted: 20 Apr 2001 ?? ?Print Version ?Bookmark and Share

Keywords:advanced power technology? d3pak? pcb mounting? ic package?

This application note is intended to compare the thermal performance of various mounting methods for the D3PAK including classic SMD PCB mounting, insulated metal substrate (IMS) mount down, etc.

View the PDF document for more information.

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