Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Reworking CSPs, ?BGAs and flip-chips

Posted: 16 Jul 2001 ?? ?Print Version ?Bookmark and Share

Keywords:csp? flip chip? reflow? rework? bga?

Rework of CSPs and flip-chip is required to achieve systems that are reliable, repeatable and cost effective.

View the PDF document for more information.



Article Comments - Reworking CSPs, ?BGAs and flip-...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top