Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Bonding, handling and mounting procedures for Millimeterwave p-HEMT MMICs

Posted: 15 Jun 2001 ?? ?Print Version ?Bookmark and Share

Keywords:m a com? amp? tyco? amplifier? gaas mmic?

This application note addresses the proper bonding, handling and mounting procedures for millimeterwave GaAs MMIC amplifiers.

View the PDF document for more information.



Article Comments - Bonding, handling and mounting proce...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top