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Direct RDRAM thermal design methodology: Determining plate temperature based on die test temperature and device power

Posted: 27 Aug 2001 ?? ?Print Version ?Bookmark and Share

Keywords:intel? rdram? memory? thermal management? power?

This application note establishes a methodology that a module vendor can follow to define the maximum allowable plate temperature, based on the following options they have in designing their module: device power; thermal interface material; module cover (or heat spreader); and maximum allowable device temperature.

View the PDF document for more information.

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