Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Memory/Storage
?
?
Memory/Storage??

Direct RDRAM thermal design methodology: Determining plate temperature based on die test temperature and device power

Posted: 27 Aug 2001 ?? ?Print Version ?Bookmark and Share

Keywords:intel? rdram? memory? thermal management? power?

This application note establishes a methodology that a module vendor can follow to define the maximum allowable plate temperature, based on the following options they have in designing their module: device power; thermal interface material; module cover (or heat spreader); and maximum allowable device temperature.

View the PDF document for more information.



Article Comments - Direct RDRAM thermal design methodol...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top