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EDA/IP??

New developments in place-and-route

Posted: 01 Oct 2001 ?? ?Print Version ?Bookmark and Share

Keywords:place-and-route? high-density chips? pwb? bga? 3d boards?

New software technologies such as free angle routing and 3D placement will increasingly become part of the board designer's toolkit to handle the new hardware technologies of microvias and high-density integrated systems on a single chip.

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