Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > EDA/IP

New developments in place-and-route

Posted: 01 Oct 2001 ?? ?Print Version ?Bookmark and Share

Keywords:place-and-route? high-density chips? pwb? bga? 3d boards?

New software technologies such as free angle routing and 3D placement will increasingly become part of the board designer's toolkit to handle the new hardware technologies of microvias and high-density integrated systems on a single chip.

View the PDF document for more information.

Article Comments - New developments in place-and-route
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top