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Frost-free environment for the thermal testing of high performance MCMs with RF circuitry

Posted: 13 Sep 2001 ?? ?Print Version ?Bookmark and Share

Keywords:temptronic? thermofixture? thermal test? thermal chamber?

This application note describes a frost-free enclosure, with plug-and-play ATE interface, for the thermal testing of high-performance multichip module (MCM) with RF circuitry.

View the PDF document for more information.

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