Sharp mounting technology enables multichip systems on film

The company has introduced an innovative technology for mass-producing high-density multichip systems-on-film (SOFs). This mounting technology and new flexible substrates enable an LSI system to use a substrate half as thin a conventional rigid ones.

The SOF technology is said to improve substantially efficiency in incorporating parts in equipment, reducing the size and weight of machines and improving performance. Unlike conventional rigid substrates, these flexible SOFs allow mounting on curved casings.

The technology facilitates the mounting of two or more LSI chips and chip condensers on a flexible substrate, which also enables half the thickness of conventional systems. Thickness is also reduced by one-fifth using thin chip parts. Drivers and controllers can likewise be mounted closer to each other on an SOF, reducing bus capacity that in turn lowers noise and power consumption.