Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

UMC may delay 300mm joint-venture fab in Singapore

Posted: 09 Jan 2002 ?? ?Print Version ?Bookmark and Share

Keywords:united microelectronics? umc? wafer fab? singapore?

United Microelectronics Corp. might delay the opening of a 300mm wafer plant joint venture in Singapore by six to nine months in the hope that a strong recovery in the chip manufacturing sector will be under way by then.

Construction on the shell for UMCi, a $3.6 billion joint venture between UMC, Infineon Technologies AG and the Singaporean government, will be completed by the end of this year. Equipment was originally scheduled to be moved into the facility in the third quarter of this year, and test production was to begin early in 2003. UMC is now reevaluating that schedule on a quarterly basis because of the prolonged downturn in semiconductor sales, a spokesman said.

UMC already has access to two 300mm wafer plants: Trecenti, a joint venture with Hitachi Ltd in Japan; and Fab 12a, a plant fully owned by UMC in southern Taiwan. The UMCi joint-venture fab is slated to produce 40,000 wafers per month when both of its modules are fully ramped.

UMC said it currently has enough capacity to safely carry it through 2002. At present, only about 40 to 45 percent of its manufacturing lines are in use. The company is expecting a small dip in sales this quarter as a seasonal slowdown settles in.

Mike Clendenin

EE Times





Article Comments - UMC may delay 300mm joint-venture fa...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top