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ChipPAC qualifies 300mm wafer packaging

Posted: 09 Jan 2002 ?? ?Print Version ?Bookmark and Share

Keywords:chippac? 300mm wafer packaging?

ChipPAC Inc., a provider of semiconductor assembly and test services, has qualified all of its front-end assembly operations in the 300mm wafer packaging. The qualification includes thinning the 300mm wafers to as little as 1505m.

"Wafer thinning is the most critical of all operations because it determines the minimum package height possible in CSP and SiP packaging," said Marcos Karnezos, CTO. "Our 300mm line can start with a 7785m thick wafer and thin it to 1505m by combining mechanical back grinding and a new mechanical polishing without resorting to the costlier chemical or plasma etching technologies less common in packaging assembly operations. We are also on track to further reduce wafer thickness on 300mm to 1005m to 1255m by the second quarter of this year, which will match our current capabilities in 200mm and allow us to continue to offer the industry's thinnest CSP (chip scale) and SiP (system-in-a-package) package families."

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