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WEDC MCP for embedded control apps packs RISC processor, SSRAMs

Posted: 09 Jan 2002 ?? ?Print Version ?Bookmark and Share

Keywords:white electronic designs? wedc? mcp? multichip package? microprocessor?

The WED3C741016M-400BX multichip package (MCP) combines a PowerPC 7410 AltiVec RISC processor with 2MB SSRAM L2 cache, and is aimed at embedded control applications where density and performance are required.

Offered in a CBGA package, the device is suitable for extended environment applications such as aerospace, guidance, navigation, power control and fire control. It is intended for high-performance space-sensitive systems and supports power-management features such as doze, nap, sleep and dynamic power management.

Offering up to 60 percent board savings, the 400MHz processor and two 256K-by-36, 200MHz, synchronous pipeline SRAM devices are flip-chip attached on a 255 CBGA. Footprint-compatible with the company's PowerPC 755 MCP, the CBGA package measures 21-by-25mm.

Other features include lower inductance and capacitance, reduced I/O count for reduced PWB density, and reduced part count.

Pricing, in volumes of 1,000, is under $1,000.





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