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National, TI team on transceivers to extend LVDS

Posted: 24 Jan 2002 ?? ?Print Version ?Bookmark and Share

Keywords:national semiconductor? ti? texas instruments? data transceiver? transceiver?

National Semiconductor Corp. and Texas Instruments Inc. will work together on a series of data transceivers to increase the utility of LVDS.

Previously limited to point-to-point communications between transmitters and receivers on a backplane, multipoint LVDS (M-LVDS) promises to enable multiple transmitters and receivers on the same bus lines. The M-LVDS devices for which National and TI plan to share marketing and product development will extend the utility of the high-bandwidth, low-power signaling technique.

The M-LVDS standard, rationalized in a recently approved spec by the TIA/EIA-899-2001, lets up to 32 nodes be connected on a shared bus for data signaling at up to 500Mbps. M-LVDS is an evolution of the TIA/EIA-644 LVDS standard, which enables multidriver connections on a shared bus for multipoint apps.

The technique increases the reliability of data transfers using LVDS techniques, said David Gagnon, TI's interface-product-marketing manager. The standard provides the electrical-layer specifications and design guidelines to allow any "talker" on the bus to address multiple receivers, without interference or impedance drops.

National and TI will collaborate on a new generation of footprint-compatible LVDS devicesprimarily bus transceiversthat meet the newly published specification. The 75176, 75180, 34050, 34051, LV047 and LV048 drivers and receivers, the companies said, have industry-standard footprints. As a result, M-LVDS products will provide high-speed upgrades for existing components. In addition to alternative sourcing, users will benefit from a common data sheet format that allows them to make easy product comparisons, Gagnon said.

Before their agreement on M-LVDS, both National and TI had developed separate devices that would allow one transmitter to address multiple concurrent receivers on an LVDS bus.

The new jointly developed devices open an immediate market for the two companies in wireless basestations, telecom digital cross-connect data carriers, storage and clock distribution networks, the companies said.

Stephan Ohr

EE Times





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