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Tin-silver copper alloy to be used in consumer applications

Posted: 30 Jan 2002 ?? ?Print Version ?Bookmark and Share

Keywords:national electronics manufacturing initiative? tin-silver-copper alloy? rflow soldering? consumer application?

The National Electronics Manufacturing Initiative Inc. (NEMI) has reported the latest findings of its Sn3.9Ag0.6Cu lead-free assembly project during an industry forum held at the APEX conference in San Diego. The project concluded that the tin-silver-copper alloy, which is recommended for reflow soldering, is now applicable for commercial consumer applications and is better than the tin-lead solder commonly used. The Sn3.9Ag0.6Cu can also be manufactured with assembly process equipment.

The NEMI project, which has involved about 30 companies working together to develop a common approach for implementation of lead-free solders, has focused activities in four areas: alloy, process, components and reliability.

"Eliminating lead in the solder used for electronic assemblies creates a ripple effect that is felt by the entire supply chain, including board manufacturers, component suppliers, and process equipment manufacturers," said Edwin Bradley, chairman of the NEMI Lead-Free Assembly Project.

"With any transition to lead-free assembly, the goal must be to understand the properties of the new materials to be used in this process so that the overall risk of implementation on product reliability, cost and cycle time is minimized. This includes promoting common solutions that allow economies of scale to be achieved," Bradley added.

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