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Agilent PCB assembly tester offers upgraded error detection

Posted: 31 Jan 2002 ?? ?Print Version ?Bookmark and Share

Keywords:agilent technologies? agilent? pcba? pcb assembly? x-ray?

With the integration of the BGA Opens Detector and Defect Analyzer, the 5DX Series 5000 automated X-ray test system for PCB assemblies offers more comprehensive and accurate fault coverage.

Aside from comparing solder-joint measurements against predefined thresholds to make a "pass/fail" determination, the new BGA Opens Detector technology also make comparisons against key measurements of adjacent joints to accommodate warpage variability. The company claims that the BGA Opens Detector has significantly improved BGA solder-joint opens detection, identifying about 80 percent of BGA opens with higher call accuracy than any other inline analysis technique.

The tester's Defect Analyzer automatically double-checks reported defects on the boards. By retesting at slightly different heights based on board-surface mapping, the system compensates for warpage or bowing in the PCB itself. The company claims that this significantly increases accuracy of "pass/fail" calls, reducing manufacturing costs while increasing shipped quality.

Furthermore, the company claims that the 5DX Series 5000 can develop programs for the test system in as little as one day compared to two or more days with past 5DX generations.

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