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Powerchip to ramp up 12-inch fab this year

Posted: 05 Feb 2002 ?? ?Print Version ?Bookmark and Share

Keywords:powerchip semiconductor? wafer?

Powerchip Semiconductor Corp. has disclosed plans to expand capacity by ramping up its 12-inch fab using 0.135m process. Guo-Zhi Tsai, president of Powerchip, indicated, "Despite the severe slowdown of DRAM industry, Powerchip will still keep upgrading process technologies and lowering cost, in a bid to leverage its operating performance."

"Our 12-inch fab will begin pilot production in the third quarter of this year using 0.135m process technology, and will start volume production in the fourth. We estimate that the total shipment of 12-inch wafer will reach 10,000 to 15,000 units by the end of this year," added Tsai.

He noted, "As for our original 0.185m process on 8-inch fabs, we will gradually change it to 0.155m process. The 0.155m process will start to ramp March this year, and we hope that the 0.155m process products will account for about 50 percent of our revenue, and that of 0.185m process will gradually decrease."

Karen Kou

Electronic Engineering Times Taiwan





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