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ChipPAC signs alliance deal with China wafer foundry

Posted: 07 Feb 2002 ?? ?Print Version ?Bookmark and Share

Keywords:chippac? smic? wafer foundry? packaging? wafer probe?

ChipPAC Inc. has signed a non-exclusive alliance agreement with China wafer foundry Semiconductor Mfg. Int. Corp. (SMIC) to support customers with end-to-end solutions from wafer fab to packaging and test and final distribution in China and the global market. The agreement covers wafer probe, packaging, assembly and test of semiconductor devices.

SMIC recently entered into pilot production producing 8-inch wafers at 0.255m (and below) technology, and it is expected to reach full capacity producing 85,000 8-inch wafers per month by the end of 2004. SMIC devices in the initial production phase are expected to include SRAM, ASIC, RAM, logic, and other kinds of chips with applications in digital TV receivers, VCD/DVD players, mobile phones and smart IC cards.





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