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Taiyo Yuden develops Bluetooth module for next-gen automotive apps

Posted: 19 Feb 2002 ?? ?Print Version ?Bookmark and Share

Keywords:taiyo yuden? embedded application? bluetooth embedded application? bluetooth development? embedded system?

The company has announced the development of a fully integrated Bluetooth v1.1-compliant module for next-generation automotive applications, including sound systems, navigational/telematics devices, and Bluetooth-based hands-free kits.

Incorporating chipsets from its Texas Instruments, the module is a Class 2 device that features an output of 4dBm (max.) and is designed for harsh automotive industry temperature specifications of -30C to 85C.

The 28-by-19.5-by-2.9mm module features 2MB of Flash memory, an RF section, and a baseband controller. The module is also suitable for higher-level applications by allowing the protocol stacks normally reliant on the host CPU to be handled by the processor embedded on the module.





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