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Philips, TriQuint ink semiconductor technology pact

Posted: 21 Feb 2002 ?? ?Print Version ?Bookmark and Share

Keywords:philips semiconductors? triquint semiconductor? ingap hbt 150mm wafer? pa? fe?

Philips Semiconductors, a division of Royal Philips Electronics, and TriQuint Semiconductor Inc. have signed a strategic partnership agreement that will allow Philips to access TriQuint's InGaP HBT 150mm wafer processing facilities. With the agreement, Philips will also gain access to TriQuint's IP for critical components in the PA and front-end modules that it designs and manufactures for mobile phones.

TriQuint and Philips said they intend to market their own products. The companies have already collaborated on a new WCDMA PA module (BGY402) and PA/front-end modules for GSM phones, which are currently available from Philips. TriQuint is also shipping PA products into the CDMA market.

The companies said future development of advanced processes will focus on consumer applications for mobile communication markets.

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