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Broadcom launches WLAN ICs, Bluetooth headset

Posted: 22 Feb 2002 ?? ?Print Version ?Bookmark and Share

Keywords:broadcom? data communication ic? networking ic? network ic? 802.11b?

The company has launched the BCM2051 direct-conversion radio, the BCM430x baseband processors, and the BCM2013 Bluetooth headset at the 3GSM World Congress. These products aim to complement the company's existing mobile communication and computing platform.

The unique architecture of Broadcom's chips allows cellular handset providers the ability to add personal and local area connectivity to complement the new 2.5G and 3G wide area services currently being deployed by cellular carriers.

The Broadcom BCM2051 2.4GHz direct-conversion radio and BCM430x family of baseband processors are claimed to be the first 802.11b-compliant chipsets to be implemented in a standard digital CMOS process. The chipsets provide built-in hardware support for current and forthcoming wireless encryption standards and are also claimed to provide improved performance in hostile multipath signal environments.

"The rapid evolution of network technology and applications in the last decade revealed the benefits of effectively connecting intelligent multimedia devices. Broadcom is applying this lesson to the mobile device market," said Dr. Henry T. Nicholas III, President and CEO of Broadcom.

"We've developed our Bluetooth and 802.11b WLAN products with consideration of how these short-range wireless technologies can address the evolving mobile data market," he added.

A member of the Blutonium line of Bluetooth products, the BCM2013 is claimed to be the industry's first Bluetooth solution developed specifically for use in wireless mobile phone headsets. The device integrates the company's Bluetooth radio together with proprietary on-chip filtering and smoothing algorithms.

Reference designs built on the BCM2013, and powered by a 190mAh Li-ion battery, are claimed to provide talk-times exceeding 10h.

The company is also offering BCM2013-based evaluation kit (BCM92013EV) and reference design (BCM92013RD) to help OEM customers accelerate their introduction of headset products to market. The reference design is a 20-by-15mm, ready-to-manufacture, headset module. Layout, schematic, gerber file, and BOM are also included.





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