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Irvine Sensors rolls out memory chips with TSOP footprint

Posted: 27 Feb 2002 ?? ?Print Version ?Bookmark and Share

Keywords:irvine sensors? microelectronics products division? mpd? memory ic? memory chip?

The company's Microelectronics Products Division (MPD) has announced the shipment of its "Skinny Stacks" stacked memory products that match the footprint of next-generation TSOP ICs.

The line includes DRAM, SRAM, and Flash memory versions that eliminate the width overhang found in older generation products, resulting in a narrower package that fits into compact card applications.

Skinny Stacks are available in 2-high, 4-high and 8-high packages, allowing customers to emulate most memory configurations. "Customers can employ advanced designs at reduced costs by using Skinny Stacks to emulate new and more expensive memory packages," said Floyd Eide, MPD GM.

"Furthermore, the exact footprint match of the Skinny Stack allows for a seamless transition to the advanced monolithic memory parts when their costs become more affordable," he adds.

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