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Microchip Technology EEPROMs have 72 percent smaller footprint

Posted: 01 Mar 2002 ?? ?Print Version ?Bookmark and Share

Keywords:microchip technology? i2c serial eeprom? eeprom? serial eeprom? memory?

Designed using the company's PMOS Electrically Erasable Cell (PEEC) process technology, the 24LCXXB and 24AAXX I?C serial EEPROMs are now packaged in 5-pin SOT-23 housings that are 58 percent smaller than 8-lead TSSOP and 72 percent smaller than 8-lead SOIC packages.

The memory devices are suitable for use in battery-powered portable devices, alarms, and sensors, as well as automotive designs that require high-density EEPROMs in miniature packages.

The 24LCXXB series feature an operating voltage of 2.5V, active current of 1mA, and a standby current of 1?A. The 24AAXX devices offer an operating voltage of 1.8V. Both are available in densities from 128 bits to 16kb.

The company also announced the release of OTP and Flash microcontrollers in MLF packages that eliminate conventional side leads thereby reducing board space by up to 50 percent.

The PIC16C62B, PIC16C63A, PIC16C72A, and PIC16C73B OTP microcontrollers, as well as the PIC16F73 and PIC16F76 Flash devices are available in 28-lead 6-by-6mm packages with a common pitch size of 0.65mm. They are also targeted for use in battery-powered portable devices and automotive applications.

Also offered is the MPLAB In-Circuit Emulator 2000 IDE tool to support designers using the MLF devices.

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