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Chomerics phase-change material simplifies heatsink removal

Posted: 01 Mar 2002 ?? ?Print Version ?Bookmark and Share

Keywords:chomerics? plastic film? phase change material? interface material? heat interface material?

The T766 phase-change features a thermal impedance of 0.04C-inch?/W, providing a low thermal resistance interface path between hot components and heat sinks, while allowing easy removal of sinks for rework operations.

The material consists of a tacky, electrically non-conductive phase-change film on one side of a metal-foil layer. The film attaches securely on the heatsink or spreader, and is protected by the foil layer during assembly. This construction allows the T766 pad to conform to mounting surfaces on thermal modules in laptop and desktop PCs, servers, and BGA packages.

The T766 pads are supplied on kiss-cut-on rolls for easy installation.





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