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SUSS MicroTec, IZM partner in wafer testing, failure analysis

Posted: 11 Mar 2002 ?? ?Print Version ?Bookmark and Share

Keywords:suss microtec test systems? fraunhofer institute for reliability microintegration? izm? wafer testing? failure analysis?

SUSS MicroTec Test Systems GmbH has signed a cooperation agreement with Fraunhofer Institute for Reliability and Microintegration (IZM). IZM will work together with SUSS to define and evaluate new technologies for failure analysis and wafer testing. The companies will also establish a submicron probing demo center at the IZM facility in Munich, which will be a hands-on application center for its visitors.

The center will demonstrate a complete failure analysis station, which include laser cutting and CAD navigation as well as, low signal probing in the SUSS ProbeShield environment. Testing will be undertaken on wafers up to 300mm as well as on bonded dies and in a wide temperature range between -55C and 300C. Part of the system will be a system for probing structures below 0.2?m, according to the companies.

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