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Tower yields first 0.18?m wafer output

Posted: 14 Mar 2002 ?? ?Print Version ?Bookmark and Share

Keywords:tower semiconductor? wafer lot? 0.18µm? fab 2?

Israel wafer manufacturer Tower Semiconductor Ltd has produced its first 0.18?m wafer output from its Fab 2 pilot line with higher-than-expected yields. The company says the move validates both the equipment and technology transfer from Toshiba Corp., and allows prototyping activities to continue as Tower readies to bring its new Fab 2 facility online.

Tower broke ground on the fab 13 months ago and completed the installation of its first tool set in January 2002. Using front-end and back-end technology from Toshiba, Tower has since tested and produced engineering prototypes on the line. Fab 2 is being built parallel to Tower's existing facility. When completed, it is expected to offer 0.18?m and below process technology, producing up to 33,000 200mm wafers per month.

"The successful manufacturing of this wafer lot on our Fab 2 pilot line demonstrates our new fab's ability to produce customer prototypes, efficiently and on time," said Yoav Nissan-Cohen, co-CEO. "This operational pilot line will, in fact, be an integral part of the final Fab 2 tool set and puts us one step closer to Fab 2's opening day, which we anticipate later this year," he added.





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