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HEM introduces lead-free solder for power packages

Posted: 18 Mar 2002 ?? ?Print Version ?Bookmark and Share

Keywords:lead free solder? ic packaging? power package? power ic package? die attachment?

Honeywell Electronic Materials has announced the development of the Bi-Ag lead-free solder for die attach in power packages. The material is positioned as a replacement for the Pb5Sn and similar high-lead alloys used in components subjected to reflow of lead-free board level solders such as Sn3.5Ag. The Bi-Ag alloy can also be used to replace silver eutectic solders.

Power device packages require the use of high-melting die attach solders to keep the die attached to the lead-frame while the package is being soldered to a PWB.

Available in wire, ribbon and performs, Bi-Ag is claimed to be the first economical lead-free die-attach solder capable of surviving secondary reflow at 260C. Additional applications in development include wafer bumping, lid sealing and BGA spheres for ceramic packages.

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