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IBM announces new processes for wireless chip fab

Posted: 20 Mar 2002 ?? ?Print Version ?Bookmark and Share

Keywords:bicmos 5pa? bicmos 5dm? bicmos 5hp? bicmos? ibm 3115?

Targeting companies that manufacture wireless devices such as cell phones, IBM has announced the development of two new foundry processes, which are based on SiGe technology, for fabricating chips for consumer products.

Based on the BiCMOS 5HP 0.5?m technology, the BiCMOS 5PA is an improved version that allows the fabrication of power amplifiers for wireless applications in a silicon-based technology. The IBM BiCMOS 5DM uses smaller resistors, varactors, and MIM capacitors for passive-rich designs, enabling a reduction of up to 50 percent in size depending on the design.

The company has also announced the availability of the IBM 3115 GSM/DCS/PCS VCOthe first SiGe wireless chip produced using the 5DM process. It is claimed that the chip replaces up to 25 discrete components used in hybrid VCO modules.

The oscillator has a 0.9mm profile and operates over the frequency range of 3.58GHz to 3.98GHz.





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