Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Kyocera develops lead-free solution

Posted: 20 Mar 2002 ?? ?Print Version ?Bookmark and Share

Keywords:lead-free manufacturing? semiconductor component? electroless plating? ceramic package?

Kyocera Corp. has developed a solution that enables lead-free manufacturing in its semiconductor components business. The company says the solution eliminates the use of lead in the manufacture of electroless plating for ceramic packages.

Yasuo Nishiguchi, president of the company, explained, "At the final process of manufacturing the ceramic package, connecting terminals such as bonding fingers/pads are covered by nickel or/and gold plating, considering the implementation of assembly at next manufacturing stage.

"In this plating process, we have two methods of electrolytic plating process which does not use any lead components and electroless plating process that uses pre-plating solution which contains lead components in order to activate the surface of plating area since this process conducts plating by using a chemical reaction," he explained further.

Article Comments - Kyocera develops lead-free solution
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top