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SUSS flip-chip bonder has up to 200kgf handling force

Posted: 22 Mar 2002 ?? ?Print Version ?Bookmark and Share

Keywords:fc259? flip chip bonder? optoelectronic device bonder? thermocompression bonder? bonding machine?

The FC259 flip-chip bonder features a handling force of 10gf, which is suitable for handling brittle substrates used for optoelectronic devices, but can be configured up to 200kgf for thermocompression processeswithout compromising accuracy and throughput.

The machine is capable of operating up to 450C, and offers a post bonding accuracy better than 1?m, while maintaining a throughput of up to 250 bonds per hour, depending on the process. It also delivers 400X magnification to the automatic alignment system and allows simultaneous viewing of the chip and substrate.

Modules are assembled by the FC250 using fiducial marks or recognizable structures on the respective parts. The machine places the parts on the planar waveguide circuit with in-situ solder reflow. It uses the company's passive alignment technology to overcome constraints such forming mechanical stops in order to make the self-alignment technique work with sufficient precision.

The machine features two parallel granite plates, building the base for air bearing guided lower alignment and microscope stages. The bonding arm is fixed to the upper granite plate. For fragile components a dedicated low-force bonding head is fitted to tightly control the bonding force.





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