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Axcelis partners with Fudan University in semiconductor R&D

Posted: 27 Mar 2002 ?? ?Print Version ?Bookmark and Share

Keywords:microelectronics? Fudan University? ion implant? rapid thermal processing? RTP?

Axcelis Technologies Inc. has entered into a cooperative R&D partnership with China's microelectronics R&D center Fudan University. The partnership will focus on ion implant and rapid thermal processing (RTP) technologies, as well as device development.

The R&D program will take place at both Fudan University's Microelectronics Center in Shanghai and Axcelis' recently opened Advanced Technology Center in Beverly, Massachusetts.

Professor Tang Ting-ao, director of the Institute of Microelectronics, Fudan University. "It is this type of collaboration that will help us build a strong semiconductor industry in China, one capable of developing great people, products and processes."

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