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Tegal develops next-generation plasma etch process

Posted: 10 Apr 2002 ?? ?Print Version ?Bookmark and Share

Keywords:plasma etch process? GaAs? telecommunication? photoresist mask?

Tegal Corp. has developed a next-generation plasma etch process for high throughput GaAs via hole etch. The new process will be used by telecommunications chip makers to pattern deep through-wafer via holes using photoresist masks.

According to the company, the plasma etch process produces either anisotropic or tapered etch profiles, as specified by a particular customer. It is also compatible with hard mask materials.

"Compound semiconductor manufacturers who implement the new backside via etch process will experience a reduction in overall manufacturing costs for high frequency telecommunications devices because of the high etch rate process," said Jim McKibben, VP of worldwide marketing and sales.

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