Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Tegal develops next-generation plasma etch process

Posted: 10 Apr 2002 ?? ?Print Version ?Bookmark and Share

Keywords:plasma etch process? GaAs? telecommunication? photoresist mask?

Tegal Corp. has developed a next-generation plasma etch process for high throughput GaAs via hole etch. The new process will be used by telecommunications chip makers to pattern deep through-wafer via holes using photoresist masks.

According to the company, the plasma etch process produces either anisotropic or tapered etch profiles, as specified by a particular customer. It is also compatible with hard mask materials.

"Compound semiconductor manufacturers who implement the new backside via etch process will experience a reduction in overall manufacturing costs for high frequency telecommunications devices because of the high etch rate process," said Jim McKibben, VP of worldwide marketing and sales.





Article Comments - Tegal develops next-generation plasm...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top