Nitto Denko yields ultra-thin printed circuit substrate

Electronics materials maker Nitto Denko Corp. has developed an ultra-thin, multilayer FPC substrate that features half the thickness of existing circuit boards. The new substrate will be used in applications such as compact electronic devices, optical sensors and semiconductor interposers.

The company claims that the substrate's wiring density has a line-to-space ratio of 50-by-505m, contributing to the reduction in substrate thickness.

According to Nitto Denko, they expect sales revenue for fiscal year 2002 to reach $764 million, and an annual sales income of $3.83 billion set for a period of three years.