Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Nitto Denko yields ultra-thin printed circuit substrate

Posted: 12 Apr 2002 ?? ?Print Version ?Bookmark and Share

Keywords:printed circuit substrate? flexible printed circuit? fpc? flexible pcb? pcb?

Electronics materials maker Nitto Denko Corp. has developed an ultra-thin, multilayer FPC substrate that features half the thickness of existing circuit boards. The new substrate will be used in applications such as compact electronic devices, optical sensors and semiconductor interposers.

The company claims that the substrate's wiring density has a line-to-space ratio of 50-by-505m, contributing to the reduction in substrate thickness.

According to Nitto Denko, they expect sales revenue for fiscal year 2002 to reach $764 million, and an annual sales income of $3.83 billion set for a period of three years.





Article Comments - Nitto Denko yields ultra-thin printe...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top