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Motorola joins Philips, STMicro, TSMC alliance

Posted: 17 Apr 2002 ?? ?Print Version ?Bookmark and Share

Keywords:Philips? STMicroelectronics? TSMC? CEA/LETI? wafer?

Motorola Inc. has joined Philips and STMicroelectronics, in conjunction with TSMC, in a five-year alliance to provide 90nm to 32nm chip technologies on 300mm wafers. The joint development program will be based in Crolles, France, in a new R&D center named Crolles2. CEA/LETI will also support the alliance by increasing its research efforts in the Grenoble, France, labs.

Motorola brings to the alliance its SOI and embedded MRAM technologies, as well as its expertise on advanced copper interconnect. This contribution builds upon the existing Philips and STMicroelectronics cooperation for core CMOS processes, which includes embedded DRAM, SRAM and analog CMOS.

Motorola, Philips and STMicroelectronics will be equal technology partners in the Crolles2 alliance in terms of capital expenditure, R&D costs and wafer load for the fab. Their joint investment will total $1.4 billion by 2005. TSMC will participate in the aligning of the CMOS platform technology between the alliance and the Taiwan maker's commercial foundry process.





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