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TRONIC'S to use Soitec SOI wafers for MEMS technology

Posted: 19 Apr 2002 ?? ?Print Version ?Bookmark and Share

Keywords:TRONIC'S Microsystems? Smart Cut UNIBOND? SOI wafer?

MEMS contract manufacturer TRONIC'S Microsystems SA has selected Soitec's Smart Cut UNIBOND silicon-on-insulator (SOI) wafers as the starting material for its SOI-based MEMS technology.

As part of the agreement, TRONIC'S will use the UNIBOND wafers to manufacture next-generation MEMS, including a new SOI-based micro-gyrometer for motion-capture applications.

Stephane Renard, president and CEO of TRONIC'S, stated, "The use of SOI as a base material for MEMS manufacturing is expected to increase because advances in SOI material technology, such as Soitec's Smart Cut process, have made the problem of limited SOI wafer supplies a thing of the past. Given its considerable performance advantages, we see employment of SOI for MEMS applications continuing to accelerate."

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