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Ismeca tape-and-reel machine system determines KGD via single test

Posted: 22 Apr 2002 ?? ?Print Version ?Bookmark and Share

Keywords:mp 630? tape and reel machine? kgd package? component packing machine? component encapsulation machine?

The MP 630 tape-and-reel machine from Ismeca Europe SA is claimed to be first integrated testing, marking, and handling system capable of determining known good die (KDG) packages through a single test.

The system combines automatic bare die handling with multiple levels of vision inspection to provide chip producers with KGD packages tested as a die, not as a wafers. The MP 630 also houses up to five test stations for sequential, parallel, or combined testing.

The MP 630 accepts standard frame-mounted wafers or individual die in waffle pack trays with output to tape, waffle pack trays, bulk bins, or reconstructed wafer with 100-percent KGD. The die are selected automatically via vision (ink-dot rejection) or by wafer mapping. They are then rotated into position and placed into a flipper nest.

The flipper nest can flip the die 180 for inspection or testing of the bottom side. The die is then inserted into a test nest where it is contacted by conventional wafer probes.

The design of the test nest provides a single contact to the die for multiple tests, thereby reducing the number of touchdown scrub marks and other physical risks.

Rejected die can be binned according to the failure mode or to a QA pack for re-inspection.

The MP 630 provides a throughput of 2,200 units per hour and features an auto-alignment capability for bond pads down to 25?m.

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