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Chipbond buys more wafer systems from August Technology

Posted: 03 May 2002 ?? ?Print Version ?Bookmark and Share

Keywords:August Technology? Chipbond? NSX-95 wafer inspection system?

Chipbond, a provider of gold and solder bumping services, has purchased three more NSX-95 wafer inspection systems from August Technology Corp. The equipment will be installed at Chipbond's bumping facility in Taiwan.

The NSX series automated systems are used by Chipbond to inspect products for visual defects in order to monitor the quality of the products being shipped and to ensure higher yields and faster time to market.

David Klenk, August Technology's president and COO, said, "Chipbond is growing rapidly in response to the increasing demand for advanced interconnects, in particular gold bumps which are often used on drivers for micro displays used in cell phones, PDAs and other consumer electronics. The additional NSX systems will allow them to closely monitor their processes and product quality as they bring additional capacity online."





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