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LSI Logic introduces 90nm SoC process

Posted: 07 May 2002 ?? ?Print Version ?Bookmark and Share

Keywords:g90? gflx? 90nm soc integration? system on a chip integration? ic design?

LSI Logic Corp. has introduced the G90 90nm SoC integration process that is aimed at accelerating the time-to-market of products with increased integration and system-level functionality.

Jointly developed with TSMC, the G90 can integrate up to 64 million logic gates and 100Mb of 6T-SRAM on a single chip with up to 800MHz of embedded processor performance. It also supports a 1V core power supply with an option for 1.2V for mixed-signal applications.

The process also features a metal pitch of 0.285m32 percent smaller than the company's Gflx solution.

The complete G90 solution includes the IP core, libraries, design tools, memories, advanced packaging and I/Os, can be designed on the 90nm platform using LSI Logic's FlexStream design environment.





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