Sanmina-SCI yields HDI PCBs at Costa Mesa plant

EMS provider Sanmina-SCI Corp. is producing high density interconnect (HDI) multilayer PCBs at its HDI manufacturing and research center in Costa Mesa, California. The company aims to support customer requirements for cost-effective technology use in product applications such as medical, optoelectronics and wireless RF modules.

George Dudnikov, Sanmina-SCI's SVP and CTO for Printed Circuit Board Fabrication, said, "one of the key enabling technologies of the Costa Mesa factory is the ability to handle thin polyimide or LCP (liquid crystal polymer) film cores down to 255m in thickness. Additional capabilities include vacuum sputtered metal deposition of seed chrome and copper, laser-formed blind and buried down to 505m diameter, and buried passive components (resistors and capacitors) utilizing patented technologies. Circuit features can be as low as 255m trace widths. Semiconductor packaging type processes include flip-chip and gold wire bond assembly technologies."