Nitto Denko PCB substrate is 50 percent thinner

Nitto Denko Corp. has announced that it has developed a multilayer FPC substrate that is half the thickness of existing materials, and is suitable for use in compact electronic devices, optical sensors, and semiconductor interposers.

A four-layer substrate measures 0.2mm, while an eight-layer substrate is 0.35mm thick. The substrate also provides a high level of wiring density with a line-to-space ratio of 50-by-505m.

The substrate is available in blind-via and solder filled-via type substrate structures. The blind-via structure is suitable for mass production and improves board conductivity with the use of through-hole coatings on internal layers, and blind-via coatings on external layers.

The solder filled-via is produced by fixing multiple double-layer FPCs together. Suitable for use in multilayer circuit substrates of six or more layers, the structure offers heat-resistant, lead-free solder paste with <105m average grain diameter to maintain conductivity.