Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Controls/MCUs

Atmel ships microcontrollers in MLF package, bare die

Posted: 15 May 2002 ?? ?Print Version ?Bookmark and Share

Keywords:avr flash microcontroller? mlf package? bare die microcontroller? micro lead frame?

Atmel Corp. has announced that it will be shipping its AVR 8-bit Flash microcontrollers in the chip-scale micro lead-frame (MLF) package and as bare die, allowing engineers to reduce the design area and use cheaper PCB technology.

The MLF package will be available in three versions5-by5mm 32-pad, 7-by-7mm 44-pad, and 9-by-9mm 64-padand and will be able to use standard production equipment for surface-mount devices.

The bare die option can be delivered either as a whole wafer, or as sawn die in waffle pack. "Designs previously requiring several ICs can now be packed into an area as small as the die itself without the need for expensive tooling for handling it," said Jim Panfil, Director of Microcontroller Marketing, Atmel.

Article Comments - Atmel ships microcontrollers in MLF ...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top