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Avant! partners with STMicro in IC, package design

Posted: 16 May 2002 ?? ?Print Version ?Bookmark and Share

Keywords:STMicroelectronics? Milkyway? Encore?

Avant! Corp. has entered into a strategic technology alliance with STMicroelectronics to develop and deploy concurrent IC and package design and analysis capability. As part of the alliance, the companies will create a new paradigm that injects aspects of IC packaging into the early stages of chip layout.

The multi-year agreement includes the development of two new products: the first providing a physical planning environment bridging the IC and package domains while the second will focus on parasitic extraction and package modeling. Additionally, Avant!'s tools, including the Milkyway database, will be enhanced to support the concurrent IC and package design flow.

"We chose Avant! because of our success with their Encore product for IC packaging," said Philippe Magarshack, VO of Central R&D Design Automation at STMicroelectronics. "While our 0.135m CMOS process enables design of innovative products, tight integration with the package is needed to ensure optimal performance. By factoring the IC package into the early stages of silicon design, we reduce our time to market and cost by reusing existing packages," Magarshack added.

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