Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > T&M

Allegro sensor packages eliminate air voids

Posted: 16 May 2002 ?? ?Print Version ?Bookmark and Share

Keywords:se package? sg package? sh package? hall sensor packaging? hall effect sensor?

The SE, SG, and SH Hall-effect sensor packages from Allegro MicroSystems Inc. integrate a magnet and a Hall-effect IC overmolded in a single step, eliminating the presence of air voids that can problematic during potting or overmolding.

The sensor packages consist of a single overmold, which holds together a samarium-cobalt magnet, a ferrous pole piece, and a Hall IC. The proximity of the magnet to the IC, along with the high operating temperature materials used in all aspects of construction, allows this technology to provide excellent heatsinking, permitting higher operating temperatures.

The smaller, molded miniature plastic body also ensures ease of assembly, manufacturability, and also allows the packages to be used in conjunction with gears of various shapes and sizes.

Article Comments - Allegro sensor packages eliminate ai...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top