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ISSI ships MCPs in Fujitsu's FBGA technology

Posted: 23 May 2002 ?? ?Print Version ?Bookmark and Share

Keywords:multichip package? mcp memory module? sram? nor type flash? flash memory?

Integrated Silicon Solution Inc. has announced the shipment of a family of stacked multichip packaged (MCP) modules that uses Fujitsu Ltd's FBGA packaging technology.

The MCP modules combine ISSI's 8Mb asynchronous SRAM with Fujitsu's 32Mb or 64Mb NOR-type Flash memories in one FBGA package, and are targeted for 2.5G and 3G phones, as well as other personal mobile appliances such as PDAs, two-way pagers, and GPS handsets.

The MCPs are available in four density combinations: 16Mb of Flash and 4Mb of SRAM, 32Mb of Flash and 8Mb of SRAM, 64Mb of Flash and 8Mb of SRAM, and 32Mb of Flash and 4Mb of SRAM.

Manufactured using a 0.155m process, ISSI's asynchronous SRAM operates from 2.7V to 3.3V and consumes 55A, while providing 70ns to 85ns of access time.

The Fujitsu NOR-Type Flash memory stores the data, operation codes and various communications protocols. It operates from 2.7V to 3.3V and provides simultaneous R/W capability between any two banks. Standby current is placed rated at 0.25A.

The MCPs are priced between $10 to $20.

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