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STATS develops thermally-enhanced PBGA

Posted: 28 May 2002 ?? ?Print Version ?Bookmark and Share

Keywords:Plastic Ball Grid Array? PBGA? XDPBGA?

ST Assembly Test Services Ltd, a semiconductor test and advanced packaging service provider, has introduced an enhanced version of its Plastic Ball Grid Array (PBGA) package called Exposed Drop in Heat Spreader Plastic Ball Grid Array (XDPBGA). The XDPBGA is offered at a lower price compared with traditional die-down packages.

The XDPBGA package is designed for applications in telecommunications, computing and peripherals as well as wireless networking applications. Its thermal characteristic makes the package suitable for laser printers, PC chipsets and graphic processors, microprocessors, set top boxes, game consoles and Gigabit Ethernet devices.

"XDPBGA offers an alternative for devices that require intermediate heat dissipation without the expense of costly traditional die-down packages," said Dr. B J Han, STATS CTO.





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